Silicon Wafer Slicing Machine 30W Laser Auto Solar Cell Cutting Machine

• Customization: Available
• After-sales Service: Life Time
• Warranty: 1 Year
• Driven Type: Electric
• Automatic Grade: Automatic
• Application: Industrial
• Integrated Design: All Part Inside & Samll Size
• Laser: Fiber Laser
• Motor: Servo Motor
• Software: English
• Condition: New
• Material: Monocrystalline Silicon
• Transport Package: Normal Container
• Specification: 30W
• Trademark: ZENITH SOLAR
• Origin: China
• HS Code: 84561000
• Production Capacity: 100set/Year

Product Description

silicon wafer slicing machine 30w laser auto solar cell cutting machine

Parameters

Model	XC-2000	Laser power	30W
Scriber precision	≤±0.1mm	Laser wavelength	1064nm
Scriber line width	≤40μm	capacity	1800 pcs/hour (one cut)
Maximum Scribing speed	≤600mm/s	solar cell	156*156-166*166mm
Power	AC220V/50HZ/2.5KW
Cooling method	Air-cooling

 

Characteristics

1. Advanced scribing technology

Adopt Raycus laser source, good quality laser beam, slim laser scribing line, more uniform solar cell cutting surface, small damage to solar cell, high accuracy cutting.
 

2. High efficiency

High laser scribing speed, producing capacity can reach to 1800 full cells/hour.
 

3. Accuracy positioning

Solar cell full automatic positioning, positioning accuracy ≤±0.1mm.
 

4. High automation level

Solar cell automatic loading and unloading, automatic positioning, automatic scribing.Stable performance, low failure rate, easy maintenance.

About production line

We can supply the customized complete production line. The engineer can adjust the layout and performance of the production line according to different requires of customers