| Customization: | Available |
|---|---|
| Application: | Industrial |
| Driven Type: | Electric |
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wafer slicing machine wafer scriber wafer dicing machine
Parameters
| Model | SFS-X30 | Laser power | 30W |
| Scriber precision | ≤±0.1mm | Laser wavelength | 1064nm |
| Scriber line width | ≤30μm | Laser repetition frequency | 30KHz~60KHz |
| Maximum Scribing speed | ≤600mm/s | Work platform size | 180*180mm |
| Power | AC220V/50HZ/2.5KW | ||
| Cooling method | Air-cooling | ||
| Work table | Single gas chamber negative pressure adsorption | ||
Characteristics
Suitable for crystalline silicon solar cell scribing, high configuration, professional control software, free-maintenance, easy to operate.
1. High configuration: adopts Raycus custom fiber laser source, the beam quality is better (standard base mode), the slit is finer (30μm), and the edge is smoother.
2. Free-maintenance: The whole machine adopts standard modular design, which is truly free-maintenance, continuous operation without interruption, and replacement of consumable parts without consumption.
3. Convenient operation: the device integrates air-cooling settings, the device is smaller and the operation is simpler.
4. Dedicated control software: Control software designed for laser scribing machine, easy to operate, can display the scribing path in real time.
5. High work efficiency: maximum efficiency of scribing can reach to 600mm/s.
6. The laser scribing machine can be equipped with an automatic loading and unloading mechanism to raise the producing efficiency, save labor.
Mr.Wang Chengwei Tel:+86-335-8382258
Mr.Wang Guanyun Tel:+86-150 3357 5192
Call:+86 13603359003
Q Q:1053649826
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