Laser scribing machine series-FSF20
Equipment of FSF laser scribing machine series, the working lamp-house is adopted to Fiber lasers and the acoustic-optics modulation system, the numerical control X/Y work table, the device of the step motor-driven. It works precise under the computer's control.The proprietary control software made the procedure of edit and revision simple and convenient,and it can display movement path at real time. The work table use the double
gas warehouse vacuum absorption system, the structure double work position works alternatively.
Application fields:
1,Cutting and engraving of mono-crystalline and poly-crystalline silicon at solar industry, of non-crystallo silicon with solar cell chip and wafer
2,Engraving and lineation of crystal less silicon cell board at solar energy industry.
3,Cutting and lineation of silicon, germanium, gallium arsenide semiconductor substrate materials at electronic industry.
Parameters
Laser power |
20W |
Bin capacity |
200 pieces |
Scriber precision |
≤±10μm |
Maximum sciber thickness |
1.2mm |
Scriber line width |
≤50μm |
Laser repetition frequency |
200Hz-50Hz |
Maximum scriber speed |
230mm/s |
Work platform size |
350*350mm |
Laser wavelength |
1.064μm |
Scribing capacity |
600 whole film/hour |
Breakage |
≤0.05% |
Battery gauge |
156*156mm |
Power |
AC220V/50HZ/2KW |
Laser maximum power |
≥20W |
Cooling ways |
Outside suspension type constant temperature circulation wind cooling |
Work platform |
The adsorption of double gas warehouse vacuum, the T model platform is double position works in turn |
About production line
We can supply the customized complete production line. The engineer can adjust the layout and performance of the production line according to different requires of customers.
Contact us