Laser Cutting Machine Wafer Scriber Auto Cutting Machine

Product Details
Customization: Available
Condition: New
Automation: Automatic
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Number of Employees
21
Year of Establishment
2010-05-18
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Basic Info.

After-sales Service
Engineers Available to Service Machinery Overseas
Application
Industrial
Integrated Design
All Part Inside & Samll Size
Laser
Fiber Laser
Motor
Servo Motor
Computer
Ipc(Industrial Personal Computer)
Software
English
Warranty
<5 Years
Number of Cells
72PCS
Certification
CE, ISO
Material
Monocrystalline Silicon
Transport Package
Normal Container
Specification
10W-20W
Trademark
ZENITH SOLAR
Origin
China
HS Code
84561000
Production Capacity
100set/Year

Product Description

Laser Cutting Machine Wafer Scriber Auto Cutting Machine

L
aser scribing machine series-FSF20 
 
Equipment of FSF laser scribing machine series, the working lamp-house is adopted to Fiber lasers and the acoustic-optics modulation system, the numerical control X/Y work table, the device of the step motor-driven. It works precise under the computer's control.The proprietary control software made the procedure of edit and revision simple and convenient,and it can display movement path at real time. The work table use the double 
gas warehouse vacuum absorption system, the structure double work position works alternatively.

Application fields:
1,Cutting and engraving of mono-crystalline and poly-crystalline silicon at solar industry, of non-crystallo silicon with solar cell chip and wafer
2,Engraving and lineation of crystal less silicon cell board at solar energy industry.
3,Cutting and lineation of silicon, germanium, gallium arsenide semiconductor substrate materials at electronic industry.

Parameters
 
 Laser power  20W  Bin capacity  200 pieces
 Scriber precision  ≤±10μm  Maximum sciber thickness  1.2mm
 Scriber line width  ≤50μm  Laser repetition frequency  200Hz-50Hz
 Maximum scriber speed  230mm/s  Work platform size  350*350mm 
 Laser wavelength  1.064μm  Scribing capacity  600 whole film/hour
 Breakage  ≤0.05%  Battery gauge  156*156mm
 Power  AC220V/50HZ/2KW  Laser maximum power  ≥20W
 Cooling ways  Outside suspension type constant temperature circulation wind cooling
 Work platform  The adsorption of double gas warehouse vacuum, the T model platform is double position works in turn

Laser Cutting Machine Wafer Scriber Auto Cutting Machine

About production line

We can supply the customized complete production line. The engineer can adjust the layout and performance of the production line according to different requires of customers.
Laser Cutting Machine Wafer Scriber Auto Cutting Machine
Laser Cutting Machine Wafer Scriber Auto Cutting Machine


Laser Cutting Machine Wafer Scriber Auto Cutting Machine
Laser Cutting Machine Wafer Scriber Auto Cutting Machine
Laser Cutting Machine Wafer Scriber Auto Cutting Machine

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