| Customization: | Available |
|---|---|
| Condition: | New |
| Automation: | Automatic |
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high efficiency silicon chip machine silicon wafer slicing
Parameters
| Model | SFS-X30/SFS-B20 (Servo/Step) | Laser power | 30W(Servo)/20W(Step) |
| Scriber precision | ≤±0.05mm | Laser wavelength | 1064nm |
| Scriber line width | ≤40μm | Laser repetition frequency | 30KHz~60KHz |
| Maximum Scribing speed | Servo≤600mm/s Step≤200mm/s | Work platform size | 180*180mm |
| Power | AC220V/50HZ/2.5KW | ||
| Cooling method | Air-cooling | ||
| Work table | Single gas chamber negative pressure adsorption | ||
Characteristics
Suitable for crystalline silicon solar cell scribing, high configuration, professional control software, free-maintenance, easy to operate.
1. High configuration: adopts Raycus custom fiber laser source, the beam quality is better (standard base mode), the slit is finer (30μm), and the edge is smoother.
2. Free-maintenance: The whole machine adopts standard modular design, which is truly free-maintenance, continuous operation without interruption, and replacement of consumable parts without consumption.
3. Convenient operation: the device integrates air-cooling settings, the device is smaller and the operation is simpler.
4. Dedicated control software: Control software designed for laser scribing machine, easy to operate, can display the scribing path in real time.
5. High work efficiency: maximum efficiency of scribing can reach to 600mm/s.
6. The laser scribing machine can be equipped with an automatic loading and unloading mechanism to raise the producing efficiency, save labor.
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