Silicon Wafer Wafer Laser Scribing Cutting Machine

Product Details
Customization: Available
Condition: New
Automation: Automatic
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Number of Employees
21
Year of Establishment
2010-05-18
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Basic Info.

After-sales Service
Engineers Available to Service Machinery Overseas
Application
Industrial
Integrated Design
All Part Inside & Samll Size
Laser
Fiber Laser
Motor
Servo Motor
Computer
Ipc(Industrial Personal Computer)
Software
English
Warranty
<5 Years
Number of Cells
72PCS
Certification
CE, ISO
Material
Monocrystalline Silicon
Transport Package
Normal Container
Specification
20W
Trademark
ZENITH SOLAR
Origin
China
HS Code
84561000
Production Capacity
100set/Year

Product Description

 

Silicon Wafer Wafer Laser Scribing Cutting Machine
 

Silicon Wafer wafer laser scribing cutting machine

Parameters

 Model  SFS-X30/SFS-B20   (Servo/Step)  Laser power  30W(Servo)/20W(Step)
 Scriber precision  ≤±0.05mm  Laser wavelength 1064nm
 Scriber line width  ≤40μm  Laser repetition frequency  30KHz~60KHz
 Maximum Scribing speed  Servo≤600mm/s   Step≤200mm/s  Work platform size  180*180mm 
 Power  AC220V/50HZ/2.5KW    
 Cooling method  Air-cooling
 Work table  Single gas chamber negative pressure adsorption
 

Characteristics

Suitable for crystalline silicon solar cell scribing, high configuration, professional control software, free-maintenance, easy to operate.

1. High configuration: adopts Raycus custom fiber laser source, the beam quality is better (standard base mode), the slit is finer (30μm), and the edge is smoother.

2. Free-maintenance: The whole machine adopts standard modular design, which is truly free-maintenance, continuous operation without interruption, and replacement of consumable parts without consumption.

3. Convenient operation: the device integrates air-cooling settings, the device is smaller and the operation is simpler.

4. Dedicated control software: Control software designed for laser scribing machine, easy to operate, can display the scribing path in real time.

5. High work efficiency: maximum efficiency of scribing can reach to 600mm/s.

6. The laser scribing machine can be equipped with an automatic loading and unloading mechanism to raise the producing efficiency, save labor.  




Silicon Wafer Wafer Laser Scribing Cutting Machine
Silicon Wafer Wafer Laser Scribing Cutting Machine
Silicon Wafer Wafer Laser Scribing Cutting Machine
Silicon Wafer Wafer Laser Scribing Cutting Machine

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